講演一覧(2018年度)
| 3 | 黒田忠広, "近接場結合３次元集積技術（招待講演）," TIA連携プログラム探索推進事業「かけはし」第3回3次元積層半導体量子イメージセンサー研究会, Jan. 2019. |
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| 2 | T. Kuroda, "3D System Integration for AI (invited)," TSMC Seminar, Nov. 2018. |
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| 1 | T. Kuroda, "Transmission Line Coupler for Eliminating Connectors and Wires in Smartphone (invited)," Huawei 2018 Multimedia Technology Summit, Apr. 2018. |
