論文一覧(2020年度)
| 14 | K. Shiba, T. Omori, K. Ueyoshi, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda, “A 96-MB 3D-Stacked SRAM Using Inductive Coupling With 0.4-V Transmitter, Termination Scheme and 12:1 SerDes in 40-nm CMOS,” IEEE Transactions on Circuits and Systems-I: Regular Papers (TCAS-I), vol. 68, no. 2, pp. 692-703, Feb. 2021. |
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| 13 | E. Charlot, M. Hamada, and T. Kuroda, "An on-chip antenna with an area of 0.9 square millimeters for RFID applications in the 5.8 GHz – 24 GHz range", IEICE 2020 International Symposium on Antennas and Propagation (ISAP), pp. 41-42, Jan. 2021. |
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| 12 | T. Omori, K. Shiba, M. Hamada, and T. Kuroda, “Sub-10-µm Coil Design for Multi-Hop Inductive Coupling Interface,” 26th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 99-100, Jan. 2021. |
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| 11 | K. Shiba, T. Omori, M. Hamada, and T. Kuroda, “A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS,” 26th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 97-98, Jan. 2021. |
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| 10 | Y. Toyoda, M. Hamada, and T. Kuroda, “Communication Distance Enhancement of Transmission Line Coupler by Using Parallelized Driver ICs,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Dec. 2020. |
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| 9 | K. Shiba, T. Omori, M. Okada, M. Hamada, and T. Kuroda, “Crosstalk Analysis and Countermeasures of High-Density Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory,” IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Dec. 2020. |
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| 8 | K. Ando, K. Shiba, K. Akatsuka, C. Cheng, T. Arakawa, M. Hamada, T.Kuroda, "A 50 Mbps/pin 12-input/output 40 nsec Latency Wireless Connector Using a Transmission Line Coupler with Compact SERDES IC in 180 nm CMOS," IEEE Conference on Electronics Circuits and Systems(ICECS), Nov. 2020. |
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| 7 | R. Miura, T. Kuroda, and M. Hamada, “A Transmission Line Coupler Component for direct B2B communications,” IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2020. |
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| 6 | M. Usui, K. Shiba, M. Hamada, and T. Kuroda, “3D Integration of Ka-band RFIC by Inductive Inter-chip Wireless Communication Using Figure-8 Coils,” IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2020. |
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| 5 | K. Shiba, T. Omori, K. Ueyoshi, K. Ando, K. Hirose, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda, “A 3D-Stacked SRAM Using Inductive Coupling with Low-Voltage Transmitter and 12:1 SerDes,” IEEE International Symposium on Circuits and Systems (ISCAS), Oct. 2020. |
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| 4 | K. Shiba, T. Omori, M. Usui, M. Hamada, and T. Kuroda, “Area-Efficient Multihop Inductive Coupling Interface for 3D-Stacked Memory With 0.23-V Transmitter and Sub-10-µm Coil Design,” IEEE Solid-State Circuits Letters (SSC-L), vol. 3, pp. 370-373, 2020. |
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| 3 | T. Kuroda, “Circuit and Package Co-design for 3D Integration (invited),” JSAP International Conference on Solid State Devices and Materials (SSDM'20), Extended Abstracts, pp. 63-64, Sep. 2020. |
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| 2 | K. Shiba, C. Cheng, M. Hamada, and T. Kuroda, "2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm2, 1.2 pJ/b data-transfer," Japanese Journal of Applied Physics (JJAP), vol. 59, no. SG, pp. SGGL06, Apr. 2020. |
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| 1 | K. Shiba, M. Hamada, and T. Kuroda, "3D system-on-a-chip design with through-silicon-via-less power supply using highly doped silicon via," Japanese Journal of Applied Physics (JJAP), vol. 59, no. SG, pp. SGGL04, Apr. 2020. |
