発表 Publication

論文一覧(2020年度)

14 K. Shiba, T. Omori, K. Ueyoshi, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda,
“A 96-MB 3D-Stacked SRAM Using Inductive Coupling With 0.4-V Transmitter, Termination Scheme and 12:1 SerDes in 40-nm CMOS,”
IEEE Transactions on Circuits and Systems-I: Regular Papers (TCAS-I), vol. 68, no. 2, pp. 692-703, Feb. 2021.
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13 E. Charlot, M. Hamada, and T. Kuroda,
"An on-chip antenna with an area of 0.9 square millimeters for RFID applications in the 5.8 GHz – 24 GHz range",
IEICE 2020 International Symposium on Antennas and Propagation (ISAP), pp. 41-42, Jan. 2021.
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12 T. Omori, K. Shiba, M. Hamada, and T. Kuroda,
“Sub-10-µm Coil Design for Multi-Hop Inductive Coupling Interface,”
26th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 99-100, Jan. 2021.
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11 K. Shiba, T. Omori, M. Hamada, and T. Kuroda,
“A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS,”
26th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 97-98, Jan. 2021.
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10 Y. Toyoda, M. Hamada, and T. Kuroda,
“Communication Distance Enhancement of Transmission Line Coupler by Using Parallelized Driver ICs,”
IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Dec. 2020.
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9 K. Shiba, T. Omori, M. Okada, M. Hamada, and T. Kuroda,
“Crosstalk Analysis and Countermeasures of High-Density Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory,”
IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Dec. 2020.
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8 K. Ando, K. Shiba, K. Akatsuka, C. Cheng, T. Arakawa, M. Hamada, T.Kuroda,
"A 50 Mbps/pin 12-input/output 40 nsec Latency Wireless Connector Using a Transmission Line Coupler with Compact SERDES IC in 180 nm CMOS,"
IEEE Conference on Electronics Circuits and Systems(ICECS), Nov. 2020.
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7 R. Miura, T. Kuroda, and M. Hamada,
“A Transmission Line Coupler Component for direct B2B communications,”
IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2020.
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6 M. Usui, K. Shiba, M. Hamada, and T. Kuroda,
“3D Integration of Ka-band RFIC by Inductive Inter-chip Wireless Communication Using Figure-8 Coils,”
IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2020.
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5 K. Shiba, T. Omori, K. Ueyoshi, K. Ando, K. Hirose, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda,
“A 3D-Stacked SRAM Using Inductive Coupling with Low-Voltage Transmitter and 12:1 SerDes,”
IEEE International Symposium on Circuits and Systems (ISCAS), Oct. 2020.
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4 K. Shiba, T. Omori, M. Usui, M. Hamada, and T. Kuroda,
“Area-Efficient Multihop Inductive Coupling Interface for 3D-Stacked Memory With 0.23-V Transmitter and Sub-10-µm Coil Design,”
IEEE Solid-State Circuits Letters (SSC-L), vol. 3, pp. 370-373, 2020.
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3 T. Kuroda,
“Circuit and Package Co-design for 3D Integration (invited),”
JSAP International Conference on Solid State Devices and Materials
(SSDM'20)
, Extended Abstracts, pp. 63-64, Sep. 2020.
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2 K. Shiba, C. Cheng, M. Hamada, and T. Kuroda,
"2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm2, 1.2 pJ/b data-transfer,"
Japanese Journal of Applied Physics (JJAP), vol. 59, no. SG, pp. SGGL06, Apr. 2020.
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1 K. Shiba, M. Hamada, and T. Kuroda,
"3D system-on-a-chip design with through-silicon-via-less power supply using highly doped silicon via,"
Japanese Journal of Applied Physics (JJAP), vol. 59, no. SG, pp. SGGL04, Apr. 2020.
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