発表 Publication

論文一覧(2020年度)

14 K. Shiba, T. Omori, K. Ueyoshi, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda,
“A 96-MB 3D-Stacked SRAM Using Inductive Coupling With 0.4-V Transmitter, Termination Scheme and 12:1 SerDes in 40-nm CMOS,”
IEEE Transactions on Circuits and Systems-I: Regular Papers (TCAS-I), vol. 68, no. 2, pp. 692-703, Feb. 2021.
pdf
13 E. Charlot, M. Hamada, and T. Kuroda,
"An on-chip antenna with an area of 0.9 square millimeters for RFID applications in the 5.8 GHz – 24 GHz range",
IEICE 2020 International Symposium on Antennas and Propagation (ISAP), pp. 41-42, Jan. 2021.
pdf
12 T. Omori, K. Shiba, M. Hamada, and T. Kuroda,
“Sub-10-µm Coil Design for Multi-Hop Inductive Coupling Interface,”
26th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 99-100, Jan. 2021.
pdf
11 K. Shiba, T. Omori, M. Hamada, and T. Kuroda,
“A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS,”
26th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 97-98, Jan. 2021.
pdf
10 Y. Toyoda, M. Hamada, and T. Kuroda,
“Communication Distance Enhancement of Transmission Line Coupler by Using Parallelized Driver ICs,”
IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Dec. 2020.
pdf
9 K. Shiba, T. Omori, M. Okada, M. Hamada, and T. Kuroda,
“Crosstalk Analysis and Countermeasures of High-Density Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory,”
IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Dec. 2020.
pdf
8 K. Ando, K. Shiba, K. Akatsuka, C. Cheng, T. Arakawa, M. Hamada, T.Kuroda,
"A 50 Mbps/pin 12-input/output 40 nsec Latency Wireless Connector Using a Transmission Line Coupler with Compact SERDES IC in 180 nm CMOS,"
IEEE Conference on Electronics Circuits and Systems(ICECS), Nov. 2020.
pdf
7 R. Miura, T. Kuroda, and M. Hamada,
“A Transmission Line Coupler Component for direct B2B communications,”
IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2020.
pdf
6 M. Usui, K. Shiba, M. Hamada, and T. Kuroda,
“3D Integration of Ka-band RFIC by Inductive Inter-chip Wireless Communication Using Figure-8 Coils,”
IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 2020.
pdf
5 K. Shiba, T. Omori, K. Ueyoshi, K. Ando, K. Hirose, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda,
“A 3D-Stacked SRAM Using Inductive Coupling with Low-Voltage Transmitter and 12:1 SerDes,”
IEEE International Symposium on Circuits and Systems (ISCAS), Oct. 2020.
pdf
4 K. Shiba, T. Omori, M. Usui, M. Hamada, and T. Kuroda,
“Area-Efficient Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory with 0.23-V Transmitter and Sub-10-μm Coil Design,”
IEEE Solid-State Circuits Letters (SSC-L), vol. 3, pp. 370-373, 2020.
pdf
3 T. Kuroda,
“Circuit and Package Co-design for 3D Integration (invited),”
JSAP International Conference on Solid State Devices and Materials
(SSDM'20)
, Extended Abstracts, pp. 63-64, Sep. 2020.
pdf
2 K. Shiba, C. Cheng, M. Hamada, and T. Kuroda,
"2.5D integration using inductive-coupling TSV-less miniature interposer achieving 317 Gb/s/mm2, 1.2 pJ/b data-transfer,"
Japanese Journal of Applied Physics (JJAP), vol. 59, no. SG, pp. SGGL06, Apr. 2020.
pdf
1 K. Shiba, M. Hamada, and T. Kuroda,
"3D system-on-a-chip design with through-silicon-via-less power supply using highly doped silicon via,"
Japanese Journal of Applied Physics (JJAP), vol. 59, no. SG, pp. SGGL04, Apr. 2020.
pdf