論文一覧(2021年度)
| 14 | A. Kosuge, M. Hamada, and T. Kuroda "A 6.5Gb/s Shared Bus Using Electromagnetic Connectors for Downsizing and Lightening Satellite Processor System," IEICE Trans. on Fundamentals of Electronics, Vol. E105-A, no. 3, pp. 478-486, Mar. 2022. |
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| 13 | R. Miura, S. Shibata, M.Usui, K. Shiba, A. Kosuge, M. Hamada and T. Kuroda, "A bonding-less 5-GHz RFID module using inductive coupling between IC and antenna," Japanese Journal of Applied Physics (JJAP), vol. 61, no. SC, pp. SC1058, Feb. 2022. |
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| 12 | A. Kosuge, M. Hamada, and T. Kuroda, "A 6-Gb/s Inductively-Powered Non-Contact Connector With Rotatable Transmission Line Coupler and Interface Bridge IC," IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 2, pp. 535-545, Feb. 2022. |
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| 11 | A. Kosuge, Y. -C. Hsu, M. Hamada, and T. Kuroda, "A 0.61-µJ/Frame Pipelined Wired-logic DNN Processor in 16-nm FPGA Using ConvolutionalNon-Linear Neural Network," IEEE Open Journal of Circuits and Systems (OJCAS), vol. 3, pp. 4-14, Jan. 2022. |
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| 10 | R. Miura, S. Shibata, M. Usui, A. Kosuge, M. Hamada, and T. Kuroda, “A 5.2GHz RFID Chip Contactlessly Mountable on FPC at Any 90-Degree Rotation and Face Orientation,” 27th Asia and South Pacific Design Automation Conference (ASP-DAC'22), pp. 5-6, Jan. 2022. |
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| 9 | T. Omori, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, “A Physical Verification Methodology for 3D-ICs Using Inductive Coupling,” IEEE Electrical Design of Advanced Packaging and Systems(EDAPS), pp. 72-74, Dec. 2021. |
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| 8 | A. Kosuge, M. Hamada, and T. Kuroda, "A 16nJ/Classification FPGA-based Wired-Logic DNN Accelerator Using Fixed-Weight Non-Linear Neural Net," IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS), vol. 11, no. 4, pp. 751-761, Dec. 2021. |
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| 7 | S. Shibata, R. Miura, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, "A 5-GHz 0.15-mm2 Collision Avoidable RFID Employing Complementary Pass-transistor Adiabatic Logic with an Inductively Connected External Antenna," IEEE Asian Solid-State Circuits Conference (A-SSCC'21), Nov. 2021. |
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| 6 | 黒田忠広, “半導体戦略 ～先々の先を撃つ～,” 學士會会報, no. 951, pp. 50-55, Nov. 2021. |
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| 5 | T. Kuroda, “Semiconductor Strategy and 3D Integration (invited),” JSAP Advanced Metallization Conference 2021 (ADMETAplus2021), Extended Abstracts, pp. 61-62, Oct. 2021. |
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| 4 | K. Shiba, T. Omori, M. Hamada, and T. Kuroda, “Area-Efficient Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory with 0.23-V Transmitter and Sub-10-µm Coil Design,” IEEE European Solid-State Circuits Conference (ESSCIRC), Sep. 2021. |
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| 3 | R. Miura, S. Shibata, M. Usui, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, "A Bonding-less 5-GHz RFID Module Using a 300um x 500um IC Chip," JSAP International Conference on Solid State Devices and Materials (SSDM'21), Extended Abstracts, pp. 686-687, Sep. 2021. |
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| 2 | 孟浩鵬, 若林一敏, 黒田忠広, "高位合成による浮動小数点用QR分解ハードウェアの設計," 情報処理学会 DAシンポジウム2021論文集, pp. 46-51, Aug. 2021. |
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| 1 | S. Morinaga, T. Ishikawa, M. Yasui, M. Hamada, and T. Kuroda, "CA2 Area Detection from Hippocampal Microscope Images Using Deep Learning," IEEE International Midwest Symposium on Circuits and Systems, pp. 603-606, Aug. 2021. |
