Papers(2014年度)
13 | 小菅敦丈, 石塚秀, 門本淳一郎, 黒田忠広, "A 6Gb/s 6pJ/b 5mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Coupler and EMC-Qualified Pulse Transceiver," IEEE SSCS Japan/Kansai Chapter ISSCC報告会, Mar. 2015. |
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12 | A. Kosuge, S. Ishizuka, M. Abe, S. Ichikawa, and T. Kuroda, "A 6.5Gb/s Shared Bus using Electromagnetic Connectors for Downsizing and Lightening Satellite Processor System by 60%," IEEE International Solid-State Circuits Conference (ISSCC'15), Dig. Tech. Papers, pp. 434-435, Feb. 2015. |
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11 | A. Kosuge, S. Ishizuka, J. Kadomoto, and T. Kuroda, "A 6Gb/s 6pJ/b 5mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Coupler and EMC-Qualified Pulse Transceiver," IEEE International Solid-State Circuits Conference (ISSCC'15), Dig. Tech. Papers, pp. 176-177, Feb. 2015. |
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10 | L. Hsu, Y. Take, A. Kosuge, S. Hasegawa, J. Kadomoto, and T. Kuroda, "Design and Analysis for ThruChip Design for Manufacturing (DFM)," 20th Asia and South Pacific Design Automation Conference (ASP-DAC'15), Proceedings, pp. 46-47, Jan. 2015. |
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9 | A. Okada, A. Raziz Junaidi, Y. Take, A. Kosuge, and T. Kuroda, "Circuit and Package Design for 44GB/s Inductive-Coupling DRAM/SoC Interface," 20th Asia and South Pacific Design Automation Conference (ASP-DAC'15), Proceedings, pp. 44-45, Jan. 2015. |
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8 | T. Kuroda, "Circuit and Device Interactions for 3D Integration Using Inductive Coupling," IEEE International Devices Meeting (IEDM 2014), Proc. Tech. Papers, 18.6.1-18.6.4, Dec. 2014. |
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7 | A. Raziz Junaidi, Y. Take, and T. Kuroda, "An Inductive-Coupling Memory/Processor Interface Using Overlapping Coils with Phase Division Multiplexing and Ultra-Thin Fan-Out Wafer Level Package," Malaysia-Japan Academic Scholar Conference(MJASC), Session M14-P18-A, Nov. 2014. |
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6 | 岡田晃, 小菅敦丈, 黒田忠広, "近接場結合を用いたLSIとモジュールの三次元集積," 電子情報通信学会論文誌, pp. 378-385, Nov. 2014. |
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5 | T. Kuroda, "3D Integration by Inductive Coupling," Proc. IEEE Custom Integrated Circuits Conf. (CICC), Session 11-3, Sep. 2014. |
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4 | D. Ditzel, T. Kuroda, and S. Lee, "Low-Cost 3D Chip Stacking with ThruChip Wireless Connections," Hot Chips - A Symposium on High Performance Chips, Aug. 2014. |
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3 | 岡田晃, 小菅敦丈, 石塚秀, 劉楽昌, 田口眞男, 石黒仁揮, 黒田忠広, "車載LAN向け非接触コネクタ及び高ノイズ耐性送受信回路," 電子情報通信学会技術研究報告, pp. 23-27, Oct. 2014. |
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2 | A. Raziz Junaidi, Y. Take, and T. Kuroda, "A 352Gb/s Inductive-Coupling DRAM/SoC Interface Using Overlapping Coils with Phase Division Multiplexing and Ultra-Thin Fan-Out Wafer Level Package," IEEE Symposium on VLSI Circuits, Dig. Tech. Papers, pp. 29-30, June 2014. |
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1 | 小菅敦丈, 石塚秀, 劉楽昌, 岡田晃, 田口眞男, 石黒仁揮, 黒田忠広, "An Electromagnetic Clip Connector for In-Vehicle LAN to Reduce Wire Harness Weight by 30%," IEEE SSCS Japan/Kansai Chapter ISSCC報告会, May. 2014. |