Publication 発表


14 A. Kosuge, M. Hamada, and T. Kuroda
"A 6.5Gb/s Shared Bus Using Electromagnetic Connectors for Downsizing and Lightening Satellite Processor System,"
IEICE Trans. on Fundamentals of Electronics, Vol. E105-A, no. 3, pp. 478-486, Mar. 2022.
13 R. Miura, S. Shibata, M.Usui, K. Shiba, A. Kosuge, M. Hamada and T. Kuroda,
"A bonding-less 5-GHz RFID module using inductive coupling between IC and antenna,"
Japanese Journal of Applied Physics (JJAP), vol. 61, no. SC, pp. SC1058, Feb. 2022.
12 A. Kosuge, M. Hamada, and T. Kuroda,
"A 6-Gb/s Inductively-Powered Non-Contact Connector With Rotatable Transmission Line Coupler and Interface Bridge IC,"
IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 2, pp. 535-545, Feb. 2022.
11 A. Kosuge, Y. -C. Hsu, M. Hamada, and T. Kuroda,
"A 0.61-µJ/Frame Pipelined Wired-logic DNN Processor in 16-nm FPGA Using ConvolutionalNon-Linear Neural Network,"
IEEE Open Journal of Circuits and Systems (OJCAS), vol. 3, pp. 4-14, Jan. 2022.
10 R. Miura, S. Shibata, M. Usui, A. Kosuge, M. Hamada, and T. Kuroda,
“A 5.2GHz RFID Chip Contactlessly Mountable on FPC at Any 90-Degree Rotation and Face Orientation,”
27th Asia and South Pacific Design Automation Conference (ASP-DAC'22), pp. 5-6, Jan. 2022.
9 T. Omori, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda,
“A Physical Verification Methodology for 3D-ICs Using Inductive Coupling,”
IEEE Electrical Design of Advanced Packaging and Systems(EDAPS), pp. 72-74, Dec. 2021.
8 A. Kosuge, M. Hamada, and T. Kuroda,
"A 16nJ/Classification FPGA-based Wired-Logic DNN Accelerator Using Fixed-Weight Non-Linear Neural Net,"
IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS), vol. 11, no. 4, pp. 751-761, Dec. 2021.
7 S. Shibata, R. Miura, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda,
"A 5-GHz 0.15-mm2 Collision Avoidable RFID Employing Complementary Pass-transistor Adiabatic Logic with an Inductively Connected External Antenna,"
IEEE Asian Solid-State Circuits Conference (A-SSCC'21), Nov. 2021.
6 黒田忠広,
“半導体戦略 ~先々の先を撃つ~,”
學士會会報, no. 951, pp. 50-55, Nov. 2021.
5 T. Kuroda,
“Semiconductor Strategy and 3D Integration (invited),”
JSAP Advanced Metallization Conference 2021 (ADMETAplus2021),
Extended Abstracts, pp. 61-62, Oct. 2021.
4 K. Shiba, T. Omori, M. Hamada, and T. Kuroda,
“Area-Efficient Multi-Hop Inductive Coupling Interface for 3D-Stacked Memory with 0.23-V Transmitter and Sub-10-µm Coil Design,”
IEEE European Solid-State Circuits Conference (ESSCIRC), Sep. 2021.
3 R. Miura, S. Shibata, M. Usui, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda,
"A Bonding-less 5-GHz RFID Module Using a 300um x 500um IC Chip,"
JSAP International Conference on Solid State Devices and Materials (SSDM'21), Extended Abstracts, pp. 686-687, Sep. 2021.
2 孟浩鵬, 若林一敏, 黒田忠広,
情報処理学会 DAシンポジウム2021論文集, pp. 46-51, Aug. 2021.
1 S. Morinaga, T. Ishikawa, M. Yasui, M. Hamada, and T. Kuroda,
"CA2 Area Detection from Hippocampal Microscope Images Using Deep Learning,"
IEEE International Midwest Symposium on Circuits and Systems,
pp. 603-606, Aug. 2021.