Papers(2023年度)
| 2 | N. Shimamoto, A. Mizushima, D. Bourrier, E. Ota, A. Higo, H. Granier, A. Kosuge, M. Ikeda, T. Kuroda, and Y. Mita, "Micron-to-Submicron Cu electroplating in view of Agile-X LSI Chips Fabrication using Open Facility," The 3rd European Symposium on Nanofabrication Research Infrastructure(ENRIS 2023),May 2023. |
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| 1 | Dongzhu Li, Yao-Chung Hsu, Rei Sumikawa, Atsutake Kosuge, Mototsugu Hamada, and Tadahiro Kuroda, "A 0.13mJ/Prediction CIFAR-100 Raster-Scan-Based Wired-Logic Processor Using Non-Linear Neural Network," IEEE International Symposium on Circuits and Systems (ISCAS), May 2023. |
