Papers(2022年度)
26 | K. Shiba, M. Okada, A. Kosuge, M. Hamada, and T. Kuroda, “A 12.8-Gb/s 0.5-pJ/b Encoding-Less Inductive Coupling Interface Achieving 111-GB/s/W 3D-Stacked SRAM in 7-nm FinFET,” IEEE Solid-State Circuits Letters (SSC-L), vol. 6, pp. 65-68, 2023. |
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25 | A. Kosuge, "Energy-efficient Neuromorphic Processor for In-Sensor Computing," Japan India Joint Research Hub Workshop on Trusted Cyber Physical Cognitive System, Feb. 2023. |
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24 | Y.-C. Hsu, A. Kosuge,R. Sumikawa, K. Shiba, M. Hamada, and T. Kuroda, "A Fully Synthesized 13.7μJ/prediction 88% Accuracy CIFAR-10 Single-Chip Data-Reusing Wired-Logic Processor Using Non-Linear Neural Network," 28th Asia and South Pacific Design Automation Conference (ASP-DAC'23), pp.182-183, Jan. 2023. |
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23 | R. Sumikawa, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, "A 1.2nJ/Classification Fully Synthesized All-Digital Asynchronous Wired-Logic Processor Using Quantized Non-linear Function Blocks in 0.18μm CMOS," 28th Asia and South Pacific Design Automation Conference (ASP-DAC'23), pp.180-181, Jan. 2023. |
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22 | R. Sumikawa, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, "1.2 nJ/classification 2.4 mm² asynchronous wired-logic DNN processor using synthesized nonlinear function blocks in 0.18 μm CMOS," Japanese Journal of Applied Physics (JJAP), vol. 62, no. SC, pp. SC1019, Jan. 2023. |
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21 | S. Shibata, R. Miura, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, "A 5-GHz 0.15-mm² Collision-Avoiding RFID Employing Complementary Pass-Transistor Adiabatic Logic With an Inductively Connected External Antenna in 0.18-μm CMOS," IEEE Solid-State Circuits Letters (SSC-L), vol. 5, pp. 268-271, Nov. 2022. |
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20 | K. Shiba, M. Okada, A. Kosuge, M. Hamada, and T. Kuroda, "A 12.8-Gbps 0.5-pJ/b Encoding-less Inductive Coupling Interface Using Clocked Hysteresis Comparator for 3D-Stacked SRAM in 7-nm FinFET," IEEE Asian Solid-State Circuits Conference (A-SSCC), Nov. 2022. |
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19 | A. Kosuge and T. Kuroda, "Proximity Wireless Communication Technologies: An Overview and Design Guidelines," IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), vol. 69, no. 11, pp. 4317-4330, Nov. 2022. |
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18 | H. Meng, K. Wakabayashi, and T. Kuroda, "A Scalable Linear Equation Solver FPGA using High-Level Synthesis," The 24th Workshop on Synthesis And System Integration of Mixed Information technologies (SASIMI2022), Oct. 2022. |
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17 | S. Shibata, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, "A Low-power RFID with 100kbps Data Rate Employing High-speed Power Clock Generator for Complementary Pass-transistor Adiabatic Logic," 29th IEEE International Conference on Electronics Circuits and Systems (ICECS 2022), Oct. 2022. |
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16 | X. Wang, A. Kosuge, Y. Hayashi, M. Hamada, T. Kuroda, "A 7 Gb/s Micro Rotatable Transmission Line Coupler with Deep Proximity Coupling Mode and Ground Shielding Vias," 29th IEEE International Conference on Electronics Circuits and Systems (ICECS 2022), Oct. 2022. |
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15 | 黒田忠広, “今が最大で最後のチャンス 覚悟を決めた 日本の半導体戦略【西川和見】【黒田忠広】," 『公研』2022年9月号「対話」, Sep. 2022. |
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14 | X. Wang, A. Kosuge, Y. Hayashi, M. Hamada, T. Kuroda, "A 12.5 Gb/s 1.1 pJ/b Rotatable Transmission Line Coupler Using Deep-Proximity Coupling Mode and Ground-Shield Vias," 2022年電子情報通信学会(IEICE)ソサイエティ大会, Sep. 2022. |
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13 | A. Kosuge, "Computational Sensing Technologies," Department Seminar at Princeton University, Sep. 2022. |
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12 | R. Sumikawa, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, "A 1.2nJ/Classification 2.4mm2 Wired-Logic Neuron Cell Array Using Logically Compressed Non-Linear Function Blocks in 0.18um CMOS," JSAP International Conference on Solid State Devices and Materials (SSDM'22), Extended Abstracts, pp. 750-751, Sep. 2022. |
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11 | T. Kuroda, "Turning 3D Memory on Its Head - How to Build an SRAM Cube to Replace High-Bandwidth Memory (HBM)," Department Seminar at Princeton University, Sep. 2022. |
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10 | S. Shibata, R. Miura, Y. Sawabe, K. Shiba, A. Kosuge, M. Hamada, and T. Kuroda, "A 5-GHz 0.15-mm2 Collision Avoidable RFID Employing Complementary Pass-transistor Adiabatic Logic with an Inductively Connected External Antenna (invited)," IEEE 48th European Solid-State Circuits Conference (ESSCIRC 2022), Sep. 2022. |
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9 | 柴康太, 小菅敦丈, 濱田基嗣, 黒田忠広, “近接場無線接続技術を用いた三次元積層SRAM,” エレクトロニクス実装学会誌, vol. 25, no. 6, pp. 549-555, Sep. 2022. |
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8 | K. Shiba, M. Okada, A. Kosuge, M. Hamada, and T. Kuroda, "A 7-nm FinFET 1.2-TB/s/mm2 3D-Stacked SRAM with an Inductive Coupling Interface Using Over-SRAM Coils and Manchester-Encoded Synchronous Transceivers," IEEE Hot Chips 34 Symposium (HCS), Aug. 2022. |
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7 | Y.-C. Hsu, A. Kosuge, R. Sumikawa, K. Shiba, M. Hamada, and T. Kuroda, "A 13.7µJ/prediction 88% Accuracy CIFAR-10 Single-Chip Wired-logic Processor in 16-nm FPGA Using Non-Linear Neural Network," IEEE Hot Chips 34 Symposium (HCS), Aug. 2022. |
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6 | L. Yu, A. Kosuge, M. Hamada, and T. Kuroda, "An Anomaly Detection System for Transparent Objects Using Polarized-Image Fusion Technique," 2022 IEEE Sensors Applications Symposium (SAS), Aug. 2022. |
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5 | 小林英太郎, 小菅敦丈, 末廣知士, 濱田基嗣, 黒田忠広, "mmWave-YOLOによるミリ波レーダを用いたリアルタイム多クラス物体認識," 第25回 画像の認識・理解シンポジウム, July 2022. |
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4 | L. Yu, A. Kosuge, M. Hamada, and T. Kuroda, "Polarized-Image Fusion Based Anomaly Detection System for Food Industry Applications," The 25th Meeting on Image Recognition and Understanding, July 2022. |
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3 | K. Shiba, M. Okada, A. Kosuge, M. Hamada, and T. Kuroda, “Polyomino: A 3D-SRAM-Centric Architecture for Randomly Pruned Matrix Multiplication with Simple Rearrangement Algorithm and x0.37 Compression Format,” IEEE International New Circuits and Systems Conference (NEWCAS), June 2022. |
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2 | K. Shiba, T. Omori, K. Ueyoshi, S. Takamaeda-Yamazaki, M. Motomura, M. Hamada, and T. Kuroda, “A 96-MB 3D-Stacked SRAM Using Inductive Coupling with 0.4-V Transmitter, Termination Scheme and 12:1 SerDes in 40-nm CMOS,” IEEE International Symposium on Circuits and Systems (ISCAS), May 2022. |
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1 | A. Kosuge, S. Suehiro, M. Hamada and T. Kuroda, "mmWave-YOLO: A mmWave Imaging Radar-Based Real-Time Multiclass Object Recognition System for ADAS Applications," IEEE Transactions on Instrumentation and Measurement, vol. 71, pp. 1-10, May 2022. |