Papers(2017年度)
| 17 | J. Sakata, M. Taguchi, S. Sasaki, T. Kuroda and K. Toda, "An EMI-less full-bridge inverter for high speed SiC switching devices," 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), pp. 2570-2576, Mar. 2018. |
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| 16 | 板倉洋, 大和田哲, 山田浩利, 吉子尚志, 市川愉, 原口雅嗣, 黒田忠広, "非接触コネクタを利用した高速伝送の受信端分岐に関する検討," 電子情報通信学会総合大会, Mar. 2018. |
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| 15 | 程超然, 宮田知輝, 門本淳一郎, 天野英晴, 黒田忠広, "ThruChip Interfaceを用いたバスにおける衝突検知," 情報処理学会 全国大会, Mar. 2018. |
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| 14 | 柴康太, 宮田知輝, 門本淳一郎, 天野英晴, 黒田忠広, "ThruChip Interfaceの設計自動化," 情報処理学会 全国大会, Mar. 2018. |
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| 13 | 松下悠亮, 小島拓也, 門本淳一郎, 黒田忠広, 天野英晴, "マルチコア積層システムCube-2の実装と評価," 情報処理学会 全国大会, Mar. 2018. |
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| 12 | 門本淳一郎, 宮田知輝, 天野英晴, 黒田忠広, "ThruChip Interfaceを用いたコア間ネットワーク," 情報処理学会 全国大会, Mar. 2018. |
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| 11 | 天野英晴, 宇佐美公良, 黒田忠広, 近藤正章, 中村宏, 並木美太郎, 松谷宏紀, "ビルディングブロック型計算システムプロジェクトの報告," 情報処理学会 全国大会, Mar. 2018. |
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| 10 | 植吉晃大, 安藤洸太, 廣瀨一俊, 高前田伸也, 門本淳一郎, 宮田知輝, 濱田基嗣, 黒田忠広, 本村真人, "QUEST: A 7.49TOPS Multi-Purpose Log-Quantized DNN Inference Engine Stacked on 96MB 3D SRAM Using Inductive-Coupling Technology in 40nm CMOS," IEEE SSCS Japan Chapter/Kansai Chapter Technical Seminar, Feb. 2018. |
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| 9 | K. Ueyoshi, K. Ando, K. Hirose, S. Takamaeda-Yamazaki, J. Kadomoto, T. Miyata, M. Hamada, T. Kuroda, and M. Motomura, "QUEST: A 7.49TOPS Multi-Purpose Log-Quantized DNN Inference Engine Stacked on 96MB 3D SRAM Using Inductive-Coupling Technology in 40nm CMOS," IEEE International Solid-State Circuits Conference (ISSCC'18), Dig. Tech. Papers, pp. 216-217, Feb. 2018. |
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| 8 | Akio Nomura, Yusuke Matsushita, Junichiro Kadomoto, Hiroki Matsutani, Tadahiro Kuroda, and Hideharu Amano, "Escalator Network for a 3D Chip Stack with Inductive Coupling ThruChip Interface," International Journal of Networking and Computing, vol. 8, no. 1, pp. 124-139, Jan. 2018. |
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| 7 | A. Nomura, J. Kadomoto, T. Kuroda, and H. Amano, "A practical collision avoidance method for an inter-chip bus with wireless inductive Through Chip Interface," International Symposium on Computing and Networking (CANDAR'17), Conference Paper, Nov. 2017. |
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| 6 | J. Kadomoto, H. Amano, and T. Kuroda, "An Inductive-Coupling Link for 3-D Network-on-Chips," 14th International SoC Design Conference (ISOCC 2017), Proceedings, pp. 150-151, Nov. 2017. |
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| 5 | S. Yanagawa, R. Shimizu, M. Hamada, T. Shimizu, and T. Kuroda, "Wireless Power Transfer to Stacked Modules for IoT Sensor Nodes," 14th International SoC Design Conference (ISOCC 2017), Proceedings, pp. 59-60, Nov. 2017. |
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| 4 | R. Shimizu, S. Yanagawa, T. Shimizu, M. Hamada, and T. Kuroda, "Convolutional Neural Network for Industrial Egg Classification," 14th International SoC Design Conference (ISOCC 2017), Proceedings, pp. 67-68, Nov. 2017. |
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| 3 | K. Ando, K. Ueyoshi, K. Orimo, H. Yonekawa, S. Sato, H. Nakahara, M. Ikebe, T. Asai, S. Takamaeda-Yamazaki, T. Kuroda, and M. Motomura, "BRein Memory: A 13-Layer 4.2 K Neuron/0.8 M Synapse Binary/Ternary Reconfigurable In-Memory Deep Neural Network Accelerator in 65 nm CMOS," IEEE Symposium on VLSI Circuits, Dig. Tech. Papers, pp. C24-C25, June 2017. |
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| 2 | M. Haraguchi, A. Kosuge, T. Igarashi, S. Masaki, M. Sueda, M. Hamada, and T. Kuroda, "A 6Gb/s Rotatable Non-Contact Connector with High-Speed/I2C/CAN/SPI Interface Bridge IC," IEEE Symposium on VLSI Circuits, Dig. Tech. Papers, pp. C150-C151, June 2017. |
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| 1 | 黒田忠広, "左脳・右脳型集積によるモバイル人工知能を目指して," 半導体産業人協会会報, No.96, pp.8-11, Apr. 2017. |
